Kerf

Increasing global demands in the highly challenging prototyping and production of silicon wafer and related substrates have been good for Loadpoint. The company has carved a niche in manufacturing bespoke equipment for cutting, dicing, grinding, polishing, slitting and drilling components used in the semiconductor, printer head, optical, ultra-sound scanning and medical diagnostic sectors.


The MicroAce 66 150mm by 150mm by 10mm capacity micro dicing machine is the latest example of how Loadpoint meets the challenges; the machine had to obtain and, crucially maintain, an axis positioning resolution of 0.1 micron to consistently achieve a pitch accuracy across components when dicing of better than three microns. The MicroAce 66 has a closed loop feedback system for ultra-precise control over the programmed cutting process, which can involve dicing wheels as large as 75mm diameter and wheels as thin as 15 microns.